Sigmoidal Chemorheological Models of Chip-Underfill Materials Offer Alternative Predictions of Combined Cure and Flow

Brian Love

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bjlove@umich.edu

2046 H.H. Dow

T: (734) 763-2013

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B.J. Love, F. Teyssandier, Y.Y. Sun, and C.P. Wong (2008)

Macromolecular Materials and Engineering, 293(10):832-835.

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